On-Chip Microbattery for Application to Integrated Circuits
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By combining 3D holographic lithography and 2D lithography, scientists at the University of Illinois at Urbana-Champaign developed a high-performance 3D microbattery for large-scale integrated circuits. The researchers said that this kind of micro-high energy battery has extremely excellent performance and expandability, providing people with unlimited imagination space, which is expected to make the miniaturization of many devices become a reality. Related papers were published in the Journal of the National Academy of Sciences.
Paul Braun, a professor of materials and engineering at the University of Illinois, who is in charge of the study, said that because miniaturized energy storage technology has always been a problem, microdevices usually provide energy from off-chip batteries or power sources. The main difficulty lies in the 3D electrode. This kind of electrode is very complicated and difficult to achieve on ordinary batteries, not to mention on-chip integration. The new technology successfully broke through the difficulties and made many important applications possible.
The paper's first author, Ning Hailong, a graduate student at the University of Illinois College of Materials and Engineering, said they have developed a miniature 3D lithium-ion battery using a technology that is highly compatible with existing microelectronics. When fabricating the electrodes, they first defined the internal structure of the electrode with 3D holographic lithography, and then used 2D lithography to shape the external shape of the electrode. With the help of 3D holographic lithography, researchers have created a perfect three-dimensional structure with a beam of light that allows the microbattery to obtain a porous electrode with excellent performance that facilitates the rapid conduction of electrons and ions inside the battery.
The significant advantage of this method is that it allows people to flexibly adjust the parameters that are closely related to battery energy and power, such as electrode size, shape, surface area, porosity, and bending state. This paved the way for the design and manufacture of next-generation chip energy storage devices.
Although 3D holographic lithography requires very precise control of the beam, recent technological advances have significantly reduced the amount of optics required for the entire process, requiring only a single beam and a standard lithography process to meet this demand. Microbattery needs.
John Rogers, a professor of materials engineering at the University of Illinois, said the technology allows this type of battery to be highly scalable and compatible with microelectronic manufacturing processes. In combination with high-energy materials such as tin, it also provides exciting new features, including high capacity and good cycle life, this kind of battery will provide safe and reliable energy for on-chip equipment.
Braun said that this miniaturized, high-energy and high-power on-chip battery will enable the development of autonomous micro-scale actuators, distributed wireless sensors, transmitters, monitors, and portable, implantable medical devices. (Reporter Wang Xiaolong)
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